Maintenance and Modifications
Handheld unit detects flaws in composite structures
NDT International has developed a smaller, less expensive way of providing C-scan images of bond flaws in composites and honeycomb structures.

NDT International has developed a smaller, less expensive way of providing C-scan images of bond flaws in composites and honeycomb structures. At just 1.5-lb, BonDetector is smaller than other bond analysis instruments, the manufacturer claims, and provides immediate visualization and interpretation of flawed areas. The West Chester, Pa.-based company has been providing equipment, supplies and technical services for the non-destructive testing industry since 1971.

Typical applications for BonDetector are locating and profiling dis-bonds, unbonds, delaminations, porosity and other structural violations. Tested materials include non-metallic laminate components; metallic and non-metallic sandwich honeycomb components; sandwich construction with various types of core; and multi-layer components.

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